MPi Wafer Probe Cards






Canteliver Probe Card

MPI Cantilever Probe Card is broadly used on gold bump and pad wafer screening for Show driver, logic, and memory product. MPI’s cantilever probes are definitely the corresponding response into the calls for of fi­ne pitch, little pad dimension, substantial pace, less cleansing, multi-DUT, large pin depend, and ultra-lower leakage needs. With superb craftsmanship, impressive architecture and verified methodologies determined by mechanical and electrical simulation/measurement effects, building MPI the highest cantilever service provider around the globe.


FCB Probe Card

The FCB Probe Card is the most mature know-how of buckling beam probe card. It can be aimed to obtain the semiconductor ship manufacture time-to-current market (TTM) and price of examination (COT) need. FCB can be a tested Option for a range of semiconductor generation tests from early engineering pilot-runs to substantial quantity production (HVM). FCB is ready for gadget requiring superior sign integrity probing (SI) and/or electrical power integrity probing (PI). Purposes include things like reducing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and much more. FCB assures the earth’s ideal All round cost-of-possession (COO) for different DUT purposes.


EVS Probe Card

The EVS Probe Card is really an enhancement around the traditional buckling beam probe card. Important options are better present carrying potential (C.C.C.) and decrease well balanced Get hold of force (BCF), together with All round MEMS-like properties. EVS can easily fulfill the necessity of Highly developed wafer probing. Precise alignment and great planarity Handle are definitely the crucial things contributing to stable Get hold of resistance. With its capacity and functionality, EVS Probe Card is an ideal choice for Innovative probe playing cards.


Osprey probe card

The Osprey probe card is MPI’s Answer to desire for at any time finer pitch. It is made for scaled-down Al pad, and is particularly ideal for small pitch application with peripheral and whole array sample. With specific alignment and much better planarity Handle, Osprey can access bigger productivity by multi-DUT style.  The forming wire (FW) sort needle generated with MPI’s have micro fabrication process not just delivers large-good quality effectiveness but will also allows simple needle replacement and shortens sustaining cycle time.



Kestrel Probe Card

The Kestrel Probe Card is equipped with MEMS wire (MW) needle that is designed for the demand of reduced force probing. Additionally, it comes with a chance to fulfill significant C.C.C. and significant pin counts software. The MEMS approach assures very constant needle traits, and the special composition style and design allows precise alignment and planarity Command.


MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and Probe Card for many generations to come.

https://www.mpi-corporation.com/probecard/

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